Name	Application
SUMIRESIN EXCEL® CRM键合胶	Semiconductor chip bonding material, suitable for general semiconductor components, thin, large semiconductor components and BGA, CSP and other cutting-edge semiconductor components, is also widely used as LED high heat dissipation chip bonding material.

Model	Features	Main use
CRM-1030 Series	Furnace hardening general-purpose type	SOT、DIP、SO、PLCC、QFP
CRM-1060 Series	fast hardening type	SOT、DIP、SO、PLCC、QFP
CRM-1070 Series	low stress type	Dip 、 so 、 PLCC 、 QFP 、 l/tqfp 、 TSOP 、 LF CSP
CRM-1080 Series	High density, high thermal conductivity type	小Chip (SOT、LED等)
CRM-1100 Series	Insulation type	SOT, DIP, SO, PlCC, OFPL/TOFP, TSOP, LF CSP
CRM-1200 Series	High thermal conductivity type, TIM	Dip 、 so 、 PLCC 、 QFP 、 l/tqfp 、 TSOP
CRM-1500 Series	Laminated substrate type	PBGA its FPBGA its FCBGA
CRM-1700 Series	Free Radical Hardening, Low Stress Type	Dip 、 so 、 PLCC 、 QFP 、 l/tqfp 、 TSOP 、 LF CSP
CRM-1800 Series	Super heat dissipation type, Ag sintering	Discrete、SO、QFP、L/TQFP、LF CSP