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Kai Ming Electronic Technology (Shanghai) Co., Ltd.
Address: Room 601A, Hongmei International Plaza, 105 Tianlin Road, Xuhui District, Shanghai
Telephone: 86-21-6475-3966
Fax: 86-21-6432-5466
Mailbox:sales@epworld.com
SUMIKON®EME sealing plastic
- Product Description
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Name Application SUMIKON®EME sealing plastic Epoxy resin molding material for semiconductor packaging, used for the protection, moisture protection and insulation of semiconductor devices, packaging of various semiconductor components, "large electronic module (ECU)", motor rotor magnet fixing, sensor module, power module protection, moisture protection, insulation packaging Model Features Main use EME-E500 Series Halogen-free, low pin count devices DIS, DIP SO EME-E590 Series Halogen-free materials, high thermal conductivity TO-220F EME-E630 Series Halogen-free materials, low stress DIP SO, PLCC, QFP EME-E670 Series Halogen-free materials, ultra-low stress DIP SO, Power Module EME-G500 Series Halogen-free, low pin count devices DIP SO, PLCC,QFP EME-G600 Series Halogen-free materials, standard materials DIP SO, PLCC, QFP EME-G620 Series Halogen-free materials, increased reliability DIP SO PLCC. QFP EME-G630 Series Halogen-free materials, standard materials DIP SO, PLCC, QFP EME-G700 Series Halogen-free materials, high reliability DIP SO, PLCC, QFP EME-G750 Series Halogen-free, laminated substrate-type package with low warpage BGA/CSP EME-G760 Series Halogen-free materials, laminated substrate packaging standard materials, high flow BGA/CSP EME-G770 Series Halogen-free materials, laminated substrate-type packaging standard material reliability increased BGA/CSP EME-G790 Series Halogen-free materials, laminated substrate packaging new generation materials, low warpage, high fluidity BGA/CSP EME-M100 Series NoneHalogen material, good formability, improve reliability Packaging for component packaging boards EME-M630 DepartmentColumn Halogen-free materials, low stress, improved reliability For fixing the IPM motorMagnet
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