Cutting cleaning fluid CL- 1203
As a water cleaning additive during wafer cutting, the cutting cleaning fluid can protect the wafer surface, prevent wafer oxidation, increase the cleanliness of the wafer surface, and significantly improve the yield of wafer wire, which is a product with high economic benefit ratio.
Series of products: New Product Zone
- Product Description
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The cutting cleaning fluid is used as a water cleaning additive during wafer cutting, which can protect the wafer surface, prevent wafer oxidation, and increase the cleanliness of the wafer surface,Significantly improve the wafer line yield, is a high economic efficiency than the product.
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Kai Ming Electronic Technology (Shanghai) Co., Ltd.
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