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Kai Ming Electronic Technology (Shanghai) Co., Ltd.
Address: Room 601A, Hongmei International Plaza, 105 Tianlin Road, Xuhui District, Shanghai
Telephone: 86-21-6475-3966
Fax: 86-21-6432-5466
Mailbox:sales@epworld.com
Wafer/IC Process Performance chemical
- Product Description
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BOE
Name Chemical formula Application BOE NH4F HF EBR
Name Chemical formula Application EBR C4H10O2 C6H12O3 Photoresistive dilution cleaning N-type Si etching solution
Name Chemical formula Application N-type Si etching solution H2SO4 Base Silicon back roughening, thinning P-type Si etching solution
Name Chemical formula Application PTypeSietching solution H2SO4 Base Silicon back roughening, thinning metal etching solution
Name Chemical formula Application metal etching solution Metal Etching copper electroplating solution
Name Chemical formula Application copper electroplating solution CuSO4 Base ICline forming, can be usedN7,N5 cobalt plating solution
Name Chemical formula Application cobalt plating solution ICline forming, can be usedN7,N5 Cutting cleaning agent
Name Chemical formula Application Cutting cleaning agent Water-soluble environment-friendly high molecular polymer Base Surface cleaning during chip cutting laser cutting protection fluid
Name Chemical formula Application laser cutting protection fluid Chip surface protection during laser cutting Residual glue cleaning agent
Name Chemical formula Application Residual glue cleaning agent *ICSemiconductor process*LEDProcess* III-V family RF IC process* Advanced copper process cleaner* Other special cleaning fluids, cleaning agents
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Kai Ming Electronic Technology (Shanghai) Co., Ltd.
Address: Room 601A, Hongmei International Plaza, 105 Tianlin Road, Xuhui District, Shanghai
Telephone: 86-21-6475-3966
Fax: 86-21-6432-5466
Mailbox:sales@epworld.com
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