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Kai Ming Electronic Technology (Shanghai) Co., Ltd.
Address: Room 601A, Hongmei International Plaza, 105 Tianlin Road, Xuhui District, Shanghai
Telephone: 86-21-6475-3966
Fax: 86-21-6432-5466
Mailbox:sales@epworld.com
Wafer/IC Process Performance chemical
- Product Description
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Name Chemical formula Application BOE NH4 HF N-type Si etching solution H2SO4 Base Silicon back roughening P-type Si etching solution H2SO4 Base Silicon back roughening metal etching solution Metal Etching copper electroplating solution CuSO4 Base IC circuit molding, can be used for N3 ~ N65 cobalt plating solution CoSO4 Base IC circuit molding, can be used for N3 ~ N65 Cutting cleaning agent H2O Base Surface cleaning during chip cutting laser cutting protection fluid Chip surface protection during laser cutting Residual glue cleaning agent Application field: * IC semiconductor process * LED process * III-V family RF IC process * advanced copper process cleaner * other special cleaning fluids, cleaning agents
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Kai Ming Electronic Technology (Shanghai) Co., Ltd.
Address: Room 601A, Hongmei International Plaza, 105 Tianlin Road, Xuhui District, Shanghai
Telephone: 86-21-6475-3966
Fax: 86-21-6432-5466
Mailbox:sales@epworld.com
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